OD tolerance 0.1 to 3mm (as per tube dimension)
Wall thickness tolerance 0.1 to 1mm (as per tube dimension)
Siding (max) 0.1 to 0.8 (as per tube dimension)
Ellipticity (max) 0.1 to 3mm (as per tube dimension)
Curvature (max) 2% to 5% (as per tube dimension)
OD tolerance 0.1 to 3mm (as per tube dimension)
Diameter tolerance 0.1 to 1mm (as per rod dimension)
Thermal Conductivity | 1.37(W/m°K) | |
---|---|---|
Coefficient Of t\Thermal Expansion(0~1000°C) | 2560 | |
Normal Operating Temperature | Continuous Usage | ~1050°C |
Non Continuous Usage | ~1200°C | |
Strain Point | ~1070°C | |
Annealing Point | ~1140°C |
Thermal Conductivity | Units of Measure | Value |
---|---|---|
Density | gm/cc (lb/ft3) | 2.18 |
Porosity | (%) | 0.01 |
Tensible Strength | 106 Pa | 48.2 |
Young’s Modulus | 106 Pa | 71.5 |
Hardness | Kg/mm2 | 580 |
Thermal Conductivity | W/m°K | 1.37 |
Fused quartz (transparent) and fused silica (translucent) are amorphous products resulting from high temperature treatment of naturally occurring quartz crystals or sand (SiO2). Fused quartz has a nominal purity of 99.99%, and fused silica 99.90%. Fused quartz and silica are attacked by phosphoric acid at temperatures in the range of 150 degrees C or higher, and by hydrofluoric acid at all temperatures.
Fused quartz and silica have an extremely low coefficient of thermal expansion which imparts a high resistance to thermal shock. Our fused quartz products can be heated to 1050 degrees C, or higher (1100 degrees C), and immersed in cold water without resultant physical damage. Annealing point is 1140 degrees C, strain point is 1070 degrees C, fusion point is between 1700 and 1800 degrees C.
Devitrification of fused quartz does not usually occur at temperatures below 1100 degrees C under normal conditions. High temperatures accelerate devitrification particularly in the presence of surface contaminants such as alkaline solutions, salts and vapors. To prevent deposit of salts, fused quartz should be handled with gloves. Radioactive materials, hydrogen and certain metals also accelerate devitrification.
Devitrification can be identified, as fused quartz cools below 250 degrees C, by a hazy film caused by micro-fine cracks. Devitrification can be forestalled by washing the quartz surface in a 10% solution of hydrofluoric acid for several minutes at room temperature, followed by a series of rinses in distilled or deionized water, followed by rapid drying.
Fused quartz and silica have excellent electrical strength that remains highly stable with temperature variation. Quartz resistivity (10 to 17th power) ohms/cc at 25 degrees C is in the order of (10 to 17th power) ohms/cc at 1000 degrees C.
Quartz, though being abundant in Earth’s crust, takes purification before putting into applications.
Purity is a critical indicator for quartz material. The semiconductor industry, in particular, demands high purity quartz because impurities, even in trace amounts, may impact heat-resistance, wear-resistance and other electrical properties of semiconductor components.
To meet requirements of the semiconductor industry, impurities in processed quartz must be kept to ppm level.
Al | Fe | Ca | Mg | Ti | Mn | B | K | Na | Li | Cu | Co | Ni | Oh |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
16 | 0.4 | 0.6 | 0.4 | 0.1 | 0.1 | 0.8 | 2.0 | 2.3 | 0.5 | 5.7 | <0.02 | 0.03 | ≦3 |
Coefficient of Thermal Expansion | 10-6/°C | 0.54 |
---|---|---|
Specific Heat | J/Kg.°K | 735 |
Dieletric Strength | Ac-kv/mm (volts/mil) | 28 |
Dieletric Constant | @1MHz | 3.80 |
Index of refraction @ 587.6nm | 1.44 |
Note:- The above information is believed to be correct but does not purport to be all inclusive and shall be used only as a guide. The information in this document is based on the present state of our knowledge and is applicable to the product with regard to appropriate safety precautions. It does not represent any guarantee of the properties of the product. Venture Scientific® shall not be held liable for any damage resulting from handling or from contact with the above product.
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